By Wen-Yee Lee
TAIPEI, April 1 (Reuters) – TSMC, the world’s largest contract chipmaker, is expected to launch equipment installation and mass production of 3-nanometre wafers in 2028 at its second factory in Japan, according to a Taiwanese government filing late on Tuesday.
In February, TSMC CEO CC Wei said the company plans to mass-produce advanced 3-nanometre chips at its second fabrication plant in Japan, during a meeting with Japan’s Prime Minister Sanae Takaichi.
(Reporting by Wen-Yee Lee; Editing by Sherry Jacob-Phillips)
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