TOKYO (Reuters) – Japan’s Kyocera Corp plans to invest 1.3 trillion yen ($9.77 billion) for manufacturing facilities and development of semiconductor-related products over three years starting in the 2023/24 business year, the Nikkei daily reported on Tuesday.
To fund the expansion for parts such as ceramics for chip-making equipment, Kyocera is looking to borrow up to around 1 trillion yen, using its 15% stake in KDDI Corp as collateral, the president Hideo Tanimoto told Nikkei in an interview.
($1 = 133.0900 yen)
(Reporting by Kantaro Komiya; Editing by Chang-Ran Kim)
